• High-purity Thin Silicon Carbide Ceramic Indexing Disk,High-purity SiC Ceramic Indexing Disk, Thin Silicon Carbide Indexing Disk, Precision SiC Ceramic Disk
  • High-purity Thin Silicon Carbide Ceramic Indexing Disk,High-purity SiC Ceramic Indexing Disk, Thin Silicon Carbide Indexing Disk, Precision SiC Ceramic Disk

High-purity Thin Silicon Carbide Ceramic Indexing Disk

No.SiC_X

Product Name: High-purity Thin Silicon Carbide Ceramic Indexing Disk

Product Material: High-Purity Silicon Carbide (SiC)

  • The material can be made from high-purity silicon carbide powder (≥99.9%) .

Material Characteristics:
High hardness and wear resistance, Excellent thermal stability, Low thermal expansion, Superior corrosion resistance, Good thermal conductivity, High mechanical strength .

Application Fields:
Semiconductor manufacturing equipment, Precision measurement systems, High-temperature processing equipment .

Application Industries:
Wafer processing and inspection, Electronic components production, Automotive electronics packaging .

Processing Difficulties:
Precise thin disk flatness control, Micro-crack prevention in high-hardness material, Maintaining dimensional accuracy during sintering, Achieving high surface finish, Avoiding deformation in large-area thin disks, Ensuring uniform material properties .

Processing Flow:
Powder preparation → Forming → Sintering → Precision grinding → Surface polishing → Quality inspection → Cleaning and packaging .

Delivery Period:
30-45 days

  • High-purity Thin Silicon Carbide Ceramic Indexing Disk,High-purity SiC Ceramic Indexing Disk, Thin Silicon Carbide Indexing Disk, Precision SiC Ceramic Disk

Description

The High-purity Thin Silicon Carbide Ceramic Indexing Disk is an advanced ceramic component engineered for high-precision positioning and indexing in semiconductor and precision manufacturing equipment. Manufactured from high-purity silicon carbide, this disk delivers exceptional dimensional stability, thermal resistance, and mechanical durability under extreme operating conditions. The combination of ultra-precise geometry and superior material properties ensures reliable performance in demanding industrial applications where accuracy and longevity are critical.

Key Features:

  • High Precision Indexing:Maintains geometric accuracy within 0.005mm for precise positioning applications

  • Exceptional Thermal Management:Thermal conductivity of 140-170 W/m·K with minimal thermal expansion

  • Superior Mechanical Properties:Bending strength of 490-700 MPa with excellent wear resistance

  • Excellent Chemical Resistance:Withstands corrosive chemicals and plasmas in semiconductor processes

  • Long-Term Reliability:Maintains stable performance through repeated thermal cycling and mechanical stress

 

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